Method for cooling of chips using a plurality of materials

Metal working – Method of mechanical manufacture – Electrical device making

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257707, 257722, 361705, H05K 334

Patent

active

056049781

ABSTRACT:
The present invention relates generally to a new apparatus and method for customized cooling of chips using a plurality of thermally conductive materials. More particularly, the invention encompasses an apparatus and a method that provides customized cooling of a MCM (Multi-Chip Module) by using a plurality of thermally conductive materials.

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