Method for cooling light-emitting diode

Details Method for cooling light-emitting diode Method for cooling light-emitting diode

2011-07-05

2011-07-05

Dang, Phuc T (Department: 2892)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Including integrally formed optical element

C438S025000, C438S029000, C257S079000, C257S099000

Reexamination Certificate

active

07972881

ABSTRACT:
A heat spreader for an LED can include a thermally conductive and optically transparent member. The bottom side of the heat spreader can be configured to attach to a light emitting side of the LED. The top and/or bottom surface of the heat spreader can have a phosphor layer formed thereon. The heat spreader can be configured to conduct heat from the LED to a package. The heat spreader can be configured to conduct heat from the phosphors to the package. By facilitating the removal of heat from the LED and phosphors, more current can be used to drive the LED. The use of more current facilitates the construction of a brighter LED, which can be used in applications such as flashlights, displays, and general illumination. By facilitating the removal of heat from the phosphors, desired colors can be better provided.

REFERENCES:
patent: 6636539 (2003-10-01), Martinsen
patent: 7514718 (2009-04-01), Shin et al.
patent: 7618157 (2009-11-01), Galvez et al.
patent: 7682048 (2010-03-01), Hsu et al.
patent: 2002/0176459 (2002-11-01), Martinsen
patent: 2005/0232818 (2005-10-01), Sandell et al.
patent: 2008/0099777 (2008-05-01), Erchak et al.
patent: 2008/0175008 (2008-07-01), Hu et al.

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