Method for cooling electronic components and thermally...

Details Method for cooling electronic components and thermally... Method for cooling electronic components and thermally...

2006-08-22

2006-08-22

Ryan, Patrick Joseph (Department: 1745)

Stock material or miscellaneous articles

Sheet including cover or casing

C428S447000, C361S688000, C361S706000

Reexamination Certificate

active

07094459

ABSTRACT:
A thermally conductive sheet includes a thermally conductive layer and an insulation layer laminated onto the thermally conductive layer. The thermally conductive layer includes matrix containing thermally conductive filler having an electrical conductivity. The insulation layer contains thermally conductive filler having an insulating property. The thermally conductive sheet is disposed so that the insulation layer covers the terminal of the electronic component and the electric circuit. At this time, the thermally conductive layer covers and closely contacts with the insulation layer and the electronic component. The heat generated by the electronic component is conducted to a cooling member through the thermally conductive layer and is ultimately dissipated.

REFERENCES:
patent: 6046907 (2000-04-01), Yamaguchi
patent: 6081428 (2000-06-01), Fujimoto
patent: 92 13 849 (1993-01-01), None
patent: 197 04549 (1997-08-01), None
patent: 0 453 764 (1991-10-01), None
patent: 2000-001616 (2000-01-01), None
patent: 2000-345040 (2000-12-01), None
“Heat Transfer Device for Electronic Modules” Research Disclosure, Kenneth Mason Publications, Hampshire, GB, No. 330, Oct. 1, 1991, p. 770.

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