Method for cooling electronic components

Details Method for cooling electronic components Method for cooling electronic components

1998-07-13

1999-11-16

Thompson, Gregory

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 152, 174252, 361720, 16510433, 257714, H05K 720

Patent

active

059868848

ABSTRACT:
There is disclosed herein a printed circuit board, one embodiment of which comprises: a dielectric substrate 10; a solid metallic heat sink 16 attached to or embedded within the substrate; a cavity 18 formed generally in the substrate, wherein at least one wall 20 of the cavity is defined by a surface 17 of the heat sink 16; a component mounting pad 14 disposed on the substrate proximate the cavity; a predetermined volume of electrically insulative liquid 22 contained within the cavity; and a thermally conductive member 24 embedded within the substrate, the member 24 being in direct thermal contact with each of the mounting pad 14 and the liquid 22.

REFERENCES:
patent: 4602314 (1986-07-01), Broadbent
patent: 5007478 (1991-04-01), Sengupta
patent: 5323294 (1994-06-01), Layton et al.
patent: 5453641 (1995-09-01), Mundinjer et al.

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