Method for cooling backside optically probed integrated circuits

Details Method for cooling backside optically probed integrated circuits Method for cooling backside optically probed integrated circuits

1998-12-23

2000-10-31

Fourson, George

Semiconductor device manufacturing: process

With measuring or testing

Optical characteristic sensed

438116, H01L 2166

Patent

active

061401412

ABSTRACT:
A method and apparatus for cooling an integrated circuit device mounted face-down on a package such that the device may be optically probed. The method of the present invention includes the following steps: (1) placing an optically-transparent window over the integrated circuit device to form a channel bounded by the optically-transparent window and the integrated circuit device and (2) flowing an optically-transparent fluid through the channel to remove heat dissipated by the integrated circuit device. The apparatus of the present invention includes: (1) an inlet for receiving an optically-transparent fluid, (2) an optically-transparent window for placement over the integrated circuit device, (3) a channel bounded by the optically-transparent window and the integrated circuit device and coupled to the inlet for directing the optically-transparent fluid to flow over the integrated circuit device to remove heat dissipated by the integrated circuit device and (4) an outlet coupled to the channel for discharging the optically-transparent fluid from the channel.

REFERENCES:
patent: 4957882 (1990-09-01), Shinomiya
patent: 5396068 (1995-03-01), Bethea
patent: 5863810 (1999-01-01), Kaldenberg
patent: 5895972 (1999-04-01), Paniccia
Anonymous: "Backside Silicon Integrated Circuit Infrared Immersion Lens/Heat-Sink", IBM Technical Dislosure Bulletin., vol. 35, No. 7, Dec. 1992, IBM Corp., New York, pp. 489-492.

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