Method for controlling warp of electronic assemblies by use of p

Details Method for controlling warp of electronic assemblies by use of p Method for controlling warp of electronic assemblies by use of p

1996-11-08

1998-07-14

Teskin, Fred

Metal working

Method of mechanical manufacture

Electrical device making

29829, 174260, 26417311, 264DIG57, H05K 346

Patent

active

057785236

ABSTRACT:
A method of controlling warp of electronic assemblies includes mounting a first component to one side of a substrate, the first component having a different coefficient of thermal expansion (CTE) than the substrate and thereby tending to generate bending moments that distort the shape of the first component, and mounting a second component to an opposite side of the substrate and opposite the first component. The second component has a CTE that approximately matches that of the first component, thereby tending to generate bending moments that offset the distorting bending moments.

REFERENCES:
patent: 3953566 (1976-04-01), Gore
patent: 4482516 (1984-11-01), Bowman et al.
patent: 4705762 (1987-11-01), Ota et al.
patent: 4963697 (1990-10-01), Peterson et al.
patent: 4985296 (1991-01-01), Mortimer, Jr.
patent: 5545473 (1996-08-01), Ameen et al.

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