Method for controlling thickness of wafer-like work pieces under

Abrasive tool making process – material – or composition – With carbohydrate or reaction product thereof

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

51118, 318607, B24B 4904

Patent

active

044335105

ABSTRACT:
The present invention relates to an improvement in the lapping method of wafer-like work pieces in a lapping machine to lap the work pieces by sandwiching them between relatively rotatable upper and lower surface plates, in which the thickness of the work pieces under lapping is determined by an in-machine manner with a sensor mounted on the upper surface plate. Different from conventional lapping methods with an in-machine measurement of the thickness, the thickness of the work pieces is computed only once at regular intervals corresponding to one relative revolution of the surface plates so that the errors due to the operation per se of the lapping machine such as the undulated revolution of the surface plates, vibration of the machine and the like can be eliminated and very much improved control means for the thickness of the work pieces under lapping can be obtained.

REFERENCES:
patent: 3089292 (1963-05-01), Hunt
patent: 3848368 (1974-11-01), Toshioka et al.
patent: 4014141 (1977-03-01), Riddle
patent: 4199902 (1980-04-01), Sauerland
patent: 4272924 (1981-06-01), Masuko

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for controlling thickness of wafer-like work pieces under does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for controlling thickness of wafer-like work pieces under, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for controlling thickness of wafer-like work pieces under will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-754254

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.