Method for controlling the thickness distribution of a deposited

Coating processes – Electrical product produced – Fluorescent or phosphorescent base coating

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

427 64, 427166, 427167, 427282, 427237, 4272555, 427251, 118730, B05D 506

Patent

active

053893972

ABSTRACT:
The thickness distribution of a vapor deposited layer such as an interference filter deposited on a substrate such as a glass faceplate for a projection television tube, is controlled in the plane of the substrate by employing at least one variable transmission mark to partially shield the substrate during deposition.

REFERENCES:
patent: 3617331 (1971-11-01), Illsley et al.
patent: 3617339 (1971-11-01), Kiwiet
patent: 3799792 (1974-03-01), Rying
patent: 4269874 (1981-05-01), Pryor et al.
patent: 4273812 (1981-06-01), Tsutsui et al.
patent: 4303489 (1981-12-01), Morrison, Jr.
patent: 4536419 (1985-08-01), Kubota et al.
patent: 4704306 (1987-11-01), Nakamura

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for controlling the thickness distribution of a deposited does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for controlling the thickness distribution of a deposited, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for controlling the thickness distribution of a deposited will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-286157

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.