Method for controlling the depth of immersion of a...

Details Method for controlling the depth of immersion of a... Method for controlling the depth of immersion of a...

2005-07-19

2005-07-19

Trinh, Michael (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S106000, C438S111000, C438S119000, C438S123000

Reexamination Certificate

active

06919229

ABSTRACT:
A method and apparatus for achieving a consistent depth of immersion of a semiconductor element into an exposed surface of an adhesive material pool when applying the adhesive material, conductive or non-conductive, to the semiconductor element or portion thereof. The consistent depth of immersion is defined by a stop which is attached to a reservoir used to form the adhesive material pool, attached to a stencil which is used in conjunction with the reservoir to form a level upper surface on the adhesive material, or operates independently from the reservoir and/or stencil.

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