Coating processes – Measuring – testing – or indicating
Patent
1992-03-10
1993-08-03
Beck, Shrive
Coating processes
Measuring, testing, or indicating
427 96, C23C 2600
Patent
active
052327361
ABSTRACT:
A method for controlling the mass of solder applied to a printed circuit substrate (202) by a solder printer (200), whereby the mass of solder paste (114) applied to a printed circuit substrate (202) is controlled by measuring the mass of the solder paste (114) that was applied to a first printed circuit substrate. The mass data measured is then compared to a predetermined mass to produce a control signal. The mass of the solder applied to a second printed circuit substrate is controlled as a function of the control signal so that the mass of the solder applied to the second substrate more closely approaches the predetermined mass.
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Gebbia Donald P.
Tribbey David A.
Beck Shrive
Berry Thomas G.
Dang Vi Duong
Koch William E.
Meles Pablo
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