Method for controlling plating rate in an electroless plating sy

Details Method for controlling plating rate in an electroless plating sy Method for controlling plating rate in an electroless plating sy

1985-03-08

1986-11-18

Smith, John D.

Coating processes

Measuring, testing, or indicating

427 9, 427 10, 427 98, 427345, C23C 1816, C23C 1840

Patent

active

046235540

ABSTRACT:
Method for controlling plating in an electroless plating process. The plating rate is continuously monitored. The plating rate is compared with a set point plating rate. A control voltage is derived proportional to the difference in plating rate and the desired plating rate, the integral of the difference, and the derivative of the difference. The control voltage is applied to a replenishment control for controlling the replenishment rate of a constituent chemical of the plating process.

REFERENCES:
patent: 3951602 (1976-04-01), Thompson
patent: 4055751 (1977-10-01), Bussmann et al.
patent: 4096301 (1978-06-01), Slominski et al.
patent: 4276323 (1981-06-01), Oka et al.
patent: 4320463 (1982-03-01), Himmelstein
patent: 4326940 (1982-04-01), Eckles et al.
patent: 4331699 (1982-05-01), Suzuki et al.
patent: 4344142 (1982-08-01), Diehr, II et al.
patent: 4479980 (1984-10-01), Acosta et al.
Production Methods, Circuits Manuf. (USA), vol. 18, No. 5, May 1978.

Affiliated with

Also associated with

Rating

Method for controlling plating rate in an electroless plating sy does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for controlling plating rate in an electroless plating sy, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for controlling plating rate in an electroless plating sy will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1617029