Method for controlling plating on seeded surfaces

Details Method for controlling plating on seeded surfaces Method for controlling plating on seeded surfaces

1987-12-08

1989-02-28

Beck, Shrive

Coating processes

Measuring, testing, or indicating

427 10, 4274431, B05D 118

Patent

active

048084310

ABSTRACT:
A method for preparing and maintaining an electroless plating bath. Seeded surfaces include a palladium and tin coating which receives plating from an electroless plating bath. The plating bath conditions are maintained by measuring the open circuit potential of the bath with a potentiostat. The chemical constituent concentration levels are adjusted to a first open circuit potential for the bath. Air is removed from the bath and the open circuit potential increases to a second level representing a bath chemical activity which produces optimum electroless plating on the seeded surfaces. Parts having seeded surfaces are inserted in the bath and a flow of air is re-established in the bath, rendering less negative the open circuit voltage potential during plating of the parts.

REFERENCES:
patent: 4152467 (1979-05-01), Alpaugh
patent: 4554184 (1985-11-01), Canestaro
patent: 4623554 (1986-11-01), Kaschak
patent: 4626446 (1986-12-01), Capwell
patent: 4654126 (1987-03-01), Amelio
patent: 4684545 (1987-08-01), Fey
patent: 4692346 (1987-09-01), McBride
patent: 4707377 (1987-11-01), Capwell
patent: 4707378 (1987-11-01), McBride

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