Method for controlling electromigration and electrically conduct

Details Method for controlling electromigration and electrically conduct Method for controlling electromigration and electrically conduct

1994-09-02

1995-12-05

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437203, 437957, H01L 21441

Patent

active

054729114

ABSTRACT:
A method and an electrically conductive interconnect structure (30) for controlling electromigration. The electrically conductive interconnect structure (30) comprises a groove (33) adjacent an electrically conductive interconnect (39). The electrically conductive interconnect (39) is patterned from a deposited layer of conductive material which contains global grain microstructures. Moreover, the electrically conductive interconnect (39) is patterned to have polycrystalline and single-grain segment lengths that are less than a length at which an electromigration flux fails to overcome a gradient-driven counter flux in a line segment. The groove (33) controls the polycrystalline and single-grain segment lengths to be less than the critical length, thereby reducing electromigration.

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M. L. Dreyer, "An electromigration model that includes the effects of microstructure and temperature on mass transport", Journal of Applied Physics 73(10), May 15, 1993, pp. 4894-4902.
Baerg, William, "Using Metal Grain Size Distributions to Predict Electromigration Performance", Solid State Technology, Mar. 1991, pp. 35-37.

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