Method for controlling deflection of substrates by temperature

Details Method for controlling deflection of substrates by temperature Method for controlling deflection of substrates by temperature

2006-01-03

2006-01-03

Koch, George (Department: 1734)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S275500, C156S275700

Reexamination Certificate

active

06982017

ABSTRACT:
A substrate consisting of a plurality of individual substrates and a photo-curable adhesive layer interposed therebetween is irradiated by a curing light, and the deflection of the substrate is controlled by controlling the temperature. The step for controlling the deflection includes the steps of finding the temperature difference ΔT between the temperature Th of a mounting table and the temperature Td of the substrates before curing; finding deflection difference ΔX between the deflection X of the substrates after curing and the target deflection setting value Xt; finding the temperature Tc by Tc=ΔT−M×ΔX by using the constant of proportionality M; and controlling the temperatures of at least one of the substrates before curing and the mounting table according to the temperature Tc such that Tc=Th−Td.

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