Method for controlling bonding wire loop weight

Metal working – Method of mechanical manufacture – Electrical device making

Patent

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Details

29593, 29850, 228 45, 228179, H05K 334, B23K 3102

Patent

active

050541943

ABSTRACT:
A method for controlling the wire loop height of wires installed during the manufacture of an electronic module with a wire bond machine provides for making adjustments based on the wire loop height adjustment resolution of the wire bond machine itself, rather than on an electrical performance specification tolerance for the module.

REFERENCES:
patent: 4226710 (1981-05-01), Bilane et al.
patent: 4327860 (1982-05-01), Kirshenboin et al.
patent: 4925085 (1990-05-01), Buxton

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