Method for continuous metal deposition from a non-autocatalytic

Details Method for continuous metal deposition from a non-autocatalytic Method for continuous metal deposition from a non-autocatalytic

1982-06-25

1984-07-10

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

204 38B, 204 52R, C25D 554, C25D 338

Patent

active

044591845

ABSTRACT:
A method of continuously depositing a metallic plating on the surface of a workpiece from a non-autocatalytic electroless plating bath that is normally inherently self-limiting as to the thickness of metal which can be deposited by electrolessly plating by applying an electric potential on the workpiece in the electroless bath. The method provides non-autocatalytic baths, such as hypophosphite-reduced electroless copper baths, with the ability to plate on nonconductors to a desired thickness which increases with time at a rate dependent on the amount of current applied. A more uniform thickness of deposit over the workpiece being plated and greater deposit penetration into blind holes, deep recesses and tubular portions of complex-shaped parts is obtainable by the method.

REFERENCES:
patent: 3597266 (1971-08-01), Leibowitz
patent: 4086149 (1978-04-01), Martinsons
patent: 4099974 (1978-06-01), Morishita
patent: 4209331 (1980-06-01), Kukanskis
F. A. Lowenheim, Electroplating, McGraw-Hill Book Co., New York, 1978, pp. 12-13.

Affiliated with

Also associated with

Rating

Method for continuous metal deposition from a non-autocatalytic does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for continuous metal deposition from a non-autocatalytic , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for continuous metal deposition from a non-autocatalytic will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1575536