Method for continuous assembly and batch molding of transistor p

Details Method for continuous assembly and batch molding of transistor p Method for continuous assembly and batch molding of transistor p

1975-07-31

1976-09-28

Tupman, W.

Metal working

Method of mechanical manufacture

Assembling or joining

29589, 228180A, 357 70, B01J 1700

Patent

active

039823172

ABSTRACT:
A method is described for continuously assembling transistors to a lead frame, capable of high speed production by automatic machinery. A carrier ribbon bearing transistor chips is fed to a work station to which a lead frame is also fed at about right angles thereto. The carrier ribbon end portion bearing one transistor is welded to a terminal of the lead frame and cut to separate it from the remainder of the ribbon. Lead frame strips bearing at least 10 transistors are separated from the remainder of the lead frame and placed in a multi-cavity mold for individually encapsulating the transistors.

REFERENCES:
patent: 3235937 (1966-02-01), Lanzl
patent: 3244040 (1966-04-01), Schmitz
patent: 3413713 (1968-12-01), Helda
patent: 3439235 (1969-04-01), Lanzl
patent: 3484536 (1969-12-01), Saeschke
patent: 3566458 (1971-03-01), O'Cone
patent: 3698074 (1972-10-01), Helda

Affiliated with

Also associated with

Rating

Method for continuous assembly and batch molding of transistor p does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for continuous assembly and batch molding of transistor p, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for continuous assembly and batch molding of transistor p will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2073965