Method for contacting contact areas located on semiconductor bod

Details Method for contacting contact areas located on semiconductor bod Method for contacting contact areas located on semiconductor bod

1977-02-24

1979-03-06

Hall, Carl E.

Metal working

Method of mechanical manufacture

Electrical device making

29591, 228 45, 228173E, 228155, 228180R, H01R 4302

Patent

active

041422880

ABSTRACT:
A method of contacting metallic contact areas located on semiconductor bodies comprises passing wires through capillary openings into contact with the connecting contacts and fixing them thereto, severing the wires at predetermined distance from the contact areas and bending the separated wires to enable them to be connected to further connecting parts.
The invention also includes a device suitable for carrying out this method.

REFERENCES:
patent: 3103137 (1963-09-01), Charschan
patent: 3581387 (1971-06-01), Buck et al.
patent: 3941298 (1976-03-01), Nicklaus
patent: 4068371 (1978-01-01), Miller

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