Metal fusion bonding – Process – Plural heat applying
Reexamination Certificate
2005-07-12
2005-07-12
Edmondson, Lynne R. (Department: 1725)
Metal fusion bonding
Process
Plural heat applying
C228S180100, C228S180220, C156S155000, C156S196000, C156S297000
Reexamination Certificate
active
06915945
ABSTRACT:
For the purpose of contact-connecting an electrical component, in particular a semiconductor component, on a substrate having a conductor structure, a joining temperature is chosen in such a way that the substrate, with a pressure being exerted on the electrical component, experiences a plastic deformation, with the result that the electrical component is pressed together with the conductor structure into the substrate in a positively locking manner. In order to produce the connection between the component and the substrate, use is preferably made of a thin diffusion solder layer which can be processed at temperatures lying below the melting point of the substrate.
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Morris, J. W. et al.: “Microstructure and Mechanical Properties of Sn-In and Sn-Bi Solders”, JOM, Minerals Metals and Materials Society, vol. 45, No. 7, Jul. 1993, pp. 25-27.
Edmondson Lynne R.
Greenberg Laurence A.
Infineon - Technologies AG
Locher Ralph E.
Stemer Werner H.
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