Method for construction of low thermal expansion and low...

Details Method for construction of low thermal expansion and low... Method for construction of low thermal expansion and low...

2011-01-11

2011-01-11

Bates, Zakiya W. (Department: 3676)

Wells

Processes

Placing or shifting well part

C166S065100, C166S242200, C175S057000, C175S090000

Reexamination Certificate

active

07866407

ABSTRACT:
A device is provided, the device comprising a downhole tool comprising a wire comprising at least one strand comprising a low thermal expansion material. The low thermal expansion material may have a low electrical resistance material disposed thereon.

REFERENCES:
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patent: 5892176 (1999-04-01), Findlay et al.
patent: 7195075 (2007-03-01), Martin et al.
Table of Resistivities, www.wikipedia.org , undated.
Thermal expansion coefficients for some common materials, www.wikipedia.org , undated.
“U.S. Appl. No. 10/739,550, Non Final Office Action mailed Mar. 9, 2006”, 6 pgs.
“U.S. Appl. No. 10/739,550, Non Final Office Action mailed Jul. 6, 2006”, 6 pgs.
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“U.S. Appl. No. 10/739,550, Response filed Apr. 20, 2006 to Non Final Office Action mailed Mar. 9, 2006”, 20 pgs.
“U.S. Appl. No. 10/739,550, Response filed Aug. 15, 2006 to Non Final Office Action mailed Jul. 6, 2006”, 22 pgs.

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