Adhesive bonding and miscellaneous chemical manufacture – Methods
Patent
1974-09-30
1976-05-25
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Methods
29576R, 156 18, 427;91, C23F 102
Patent
active
039590470
ABSTRACT:
Disclosed is an improved method for manufacturing semiconductor integrated circuitry whereby interconnection pad limiting metallurgy and read only fusible link memory structure is simultaneously formed by first blank depositing a composite metal film followed by in situ forming pad metallurgy and said read only link structure utilizing photoresist and etch techniques. Said read only memory link structure is utilized for directing the use of redundant lines in place of defective array bits.
REFERENCES:
patent: 3430104 (1969-02-01), Burgess et al.
patent: 3697318 (1972-10-01), Feinberg et al.
patent: 3740523 (1973-06-01), Cohen et al.
patent: 3780320 (1973-12-01), Dorler et al.
IBM Technical Discosure Bulletin, Vol. 14, No. 7, Dec. 1971, Integrated Magnetic Memory Structure, W. B. Archey et al., pp. 1977 and 1978.
IBM Technical Disclosure Bulletin, Vol. 16, No. 4, Sept. 1973, Passivated Refractory Gate Field Transistor by J. R. Gardiner et al., pp. 1064 & 1065.
Alberts Gene Stoddard
Farrar Paul Alden
Hallen Robert Lee
Igo Daniel E.
International Business Machines - Corporation
Powell William A.
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