Method for constructing a light-emitting diode printhead with a

Incremental printing of symbolic information – Light or beam marking apparatus or processes – Scan of light

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347237, B41J 247, B41J 2435, B41J 245

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058284001

ABSTRACT:
A method for connecting selected bonding pads of a universal current driver IC supporting a maximum resolution, e.g., 600 DPI, with the appropriate bonding pads of the same or a lower resolution LED chip array. The output pads of the current driver IC and the pads of the LED elements of each LED chip array or segment are matched so that wire bonding takes place between the physically closest pads. Consequently, the universal current driver IC may be employed with LED chips or segments of a certain standardized length that contain 96 LED elements for 300 DPI, 128 LED elements for 400 DPI, and 192 LED elements for 600 DPI or the like. The selection algorithm, in picking the physically closest IC current driver pad to be connected to an LED element pad leaves certain stages of the IC driver unconnected.

REFERENCES:
patent: 4951098 (1990-08-01), Albergo et al.
patent: 5307089 (1994-04-01), Takasu et al.
patent: 5317344 (1994-05-01), Beaman et al.
patent: 5389953 (1995-02-01), Agar et al.
US Patent Application 07/581,825, filed Sep. 12, 1990 in the names of LaPointe et al.

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