Method for constructing a dual sided, wire bonded integrated cir

Details Method for constructing a dual sided, wire bonded integrated cir Method for constructing a dual sided, wire bonded integrated cir

1993-10-13

1994-11-22

Hearn, Brian

Fishing, trapping, and vermin destroying

437207, 437208, 437209, 437214, 437217, 437220, H01L 2160

Patent

active

053669339

ABSTRACT:
A method for constructing a dual sided integrated circuit chip package. A leadframe is formed comprising a set of die pads, and a set of lead fingers corresponding to each die pad. An integrated circuit die is disposed onto a first side and a second side of each die pad. Each integrated circuit die is wire bonded to the corresponding lead fingers. The temperature during the second side die attach and wire bonding steps is controlled and/or compatible materials are selected to prevent warping of the leadframe, and special steps are also implemented to eliminate mold flash, plastic mold cracking and overcuring and increasing the adhesion.

REFERENCES:
patent: 5034350 (1991-07-01), Marchisi
patent: 5082802 (1992-01-01), Gelsomini
patent: 5202288 (1993-04-01), Doering et al.
patent: 5227338 (1993-07-01), Kryzaninsky
patent: 5273938 (1993-12-01), Lin et al.

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