Method for connection of signals to an integrated circuit

Details Method for connection of signals to an integrated circuit Method for connection of signals to an integrated circuit

1994-05-09

1996-03-26

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

174251, 257668, 264 61, H05K 334

Patent

active

055010067

ABSTRACT:
A method and apparatus for connecting signal leads to an integrated circuit transmits a distribution signal on a lead. A substrate is provided with leads interconnecting a number of bonding pads. The integrated circuit has a corresponding number of bonding pads. An insulation layer is interposed between the integrated circuit and the substrate except for the bonding pads. The distribution lead is connected to the bonding pads on the substrate. The bonding pads of the substrate and the bonding pads of integrated circuit are interconnected. With this approach, signals may be distributed radially from a central point to equidistant circuits instead of sequentially or serially through a number of circuits.

REFERENCES:
patent: 3239719 (1966-03-01), Shower
patent: 4169001 (1979-09-01), Kaiser
patent: 5164817 (1992-11-01), Eisenstadt et al.
patent: 5212403 (1993-05-01), Nakanishi et al.
patent: 5293067 (1994-03-01), Thompson et al.

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