Method for connecting two substrates in a thick film hybrid circ

Details Method for connecting two substrates in a thick film hybrid circ Method for connecting two substrates in a thick film hybrid circ

1997-04-16

1998-10-20

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361742, 361803, 361804, 439 69, 439 74, 439 91, H05F 111, H01R 909

Patent

active

058256318

ABSTRACT:
Two hybrid circuit components are connected to one another by a ceramic block. Electrical connections are made between the hybrid components by conductive vias through the ceramic block. The ceramic block is disposed toward an edge of the hybrid components so that integrated circuits and/or discrete electrical components may be attached to a major portion of both surfaces of each hybrid substrate. The interconnected hybrid components form a compact electrical device, for example, a hearing aid.

REFERENCES:
patent: 4203203 (1980-05-01), Gilissen et al.
patent: 4421370 (1983-12-01), Treakle et al.
patent: 5013249 (1991-05-01), Lindeman et al.
patent: 5130894 (1992-07-01), Miller
patent: 5147207 (1992-09-01), Mowry
patent: 5426563 (1995-06-01), Moresco et al.
patent: 5491303 (1996-02-01), Weiss
patent: 5536177 (1996-07-01), Casey

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