Method for connecting terminals of heat seal film substrate

Details Method for connecting terminals of heat seal film substrate Method for connecting terminals of heat seal film substrate

1992-11-13

1994-03-29

Beck, Shrive

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427261, 427265, 427370, 4274125, B05D 100

Patent

active

052982793

ABSTRACT:
A hot melt agent is printed between terminals of a heat seal film substrate 1 having a circuit printed of conductive material on a base film such as polyester. An anisotropic film mixing nickel particles is printed on the terminals. Afterwards, a hot melt agent is printed on the upper surface, and thermo-compression bonded to the printed wiring board on the opposite side. Hence, deviation of terminals is prevented at the time of connection of heat seal film substrate connected by thermo-compression bonding, while elongation of base film is prevented, so that terminals may be connected accurately, so as to be applicable to fine pitches.

REFERENCES:
patent: 4269680 (1981-05-01), Rowe
patent: 4626961 (1986-12-01), Ono
patent: 4814040 (1989-03-01), Ozawa
patent: 5019944 (1991-05-01), Ishii
patent: 5038251 (1991-08-01), Sugiyama
patent: 5049085 (1991-09-01), Reylek

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