Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Patent
1994-09-30
1996-05-07
Yee, Deborah
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Wire contact, lead, or bond
257780, 257737, 257738, 2281805, 228904, 437209, 437183, H01L 2160, H01L 2354, H01L 2940
Patent
active
055149120
ABSTRACT:
This invention relates to a connection method for a semiconductor material enabling a formation of a bump electrode with a wire bonder, keeping always a cutting position of the wire at a specified position and improving a continuous workability and stability and to a connection material to be used in the connecting method, wherein any one of Pb, Sn, In is applied as a major element and the alloy having additive elements mixed with it is made as a fine wire under a rapid cooling and condensation process and further to a semiconductor device made by the above-mentioned connecting method.
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Tanaka Denshi Kogyo Kabushiki Kaisha
Yee Deborah
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