Wave transmission lines and networks – Transmission line inductive or radiation interference...
Patent
1997-12-19
2000-01-18
Bettendorf, Justin P.
Wave transmission lines and networks
Transmission line inductive or radiation interference...
361818, H03H 701
Patent
active
060160845
ABSTRACT:
A ground pattern of a printed circuit board of an electronic instrument is connected with a conductive part of a housing of the instrument by a series combination of components respectively having the inductive nature and capacitive nature, or by a series combination of components respectively having the resistive nature and capacitive nature, or by a series combination of components respectively having the inductive nature, capacitive nature, and resistive nature. In this way the impedance can be adjusted against frequency so as to be ready for the frequency where the standing wave appears, the resonance frequency of LC series circuit, and harmonic frequencies of electric current flowing on the circuit board. In another arrangement, the ground pattern of a printed circuit board is connected with the conductive part of the housing of instrument through a plurality of separate connection paths with different impedances.
REFERENCES:
patent: 4563660 (1986-01-01), McNeilly
patent: 5208560 (1993-05-01), Yasutake
patent: 5351018 (1994-09-01), Lehmann et al.
patent: 5686871 (1997-11-01), Baran
patent: 5717359 (1998-02-01), Matsui et al.
patent: 5841202 (1998-11-01), Noguchi et al.
H.W. Ott, "Noise Reduction Techniques in Electronic Systems", Second Edition, Jun. 1988, pp. 315-321.
Bettendorf Justin P.
Canon Kabushiki Kaisha
LandOfFree
Method for connecting printed circuit board with housing, and el does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for connecting printed circuit board with housing, and el, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for connecting printed circuit board with housing, and el will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-565615