Method for connecting microchips to an antenna arranged on a...

Electric heating – Metal heating – By arc

Reexamination Certificate

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Details

C156S230000, C156S235000, C156S239000, C219S085130

Reexamination Certificate

active

06972394

ABSTRACT:
The invention relates to a method of connecting micro-chip modules to antennas arranged on a first carrier tape for the manufacture of transponders. The method is characterised in that the micro-chips are packaged in a preceding bonding process to form a chip module with electrical terminals and are applied to a second carrier tape. The two carrier tapes are wound off a reel and brought one above the other, whereby the chip modules are removed from the second carrier tape and placed at a predetermined point on the first carrier tape. This method facilitates a continuous manufacturing process which is particularly economical and particularly fast.

REFERENCES:
patent: 4414444 (1983-11-01), Schneider
patent: 5470411 (1995-11-01), Gloton et al.
patent: 5867102 (1999-02-01), Souder et al.
patent: 5902437 (1999-05-01), McDonough et al.
patent: 6214444 (2001-04-01), Uchibori
patent: 6334921 (2002-01-01), Duschek
patent: 6827817 (2004-12-01), Bleckmann et al.
patent: 197 09 985 (1997-03-01), None
patent: 199 12 201 (1999-03-01), None
patent: 199 15 765 (1999-04-01), None
patent: 199 16 781 (1999-04-01), None
patent: 0 952 543 (1999-10-01), None
patent: 2 795 203 (2000-12-01), None
patent: WO 98/14904 (1998-04-01), None

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