Method for connecting electronic device

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S846000, C174S259000, C427S097100

Reexamination Certificate

active

07370412

ABSTRACT:
An electronic device connecting method according to a first aspect of the present invention includes: mounting an electronic device having at least one electrode portion on a sheet-like porous member having a hole therein so that the electrode portion is close to the porous member; selectively irradiating a predetermined region of the porous member, on which the electronic device is mounted, with energy lines to form a latent image in an irradiated or non-irradiated portion of the porous member, the predetermined region including a portion close to the electrode portion; after irradiating with the energy lines, filling a conductive material in a hole of the latent image of the porous member to form a conductive portion; and bonding and integrating the porous member, in which the conductive portion is formed, to and with the electronic device.

REFERENCES:
patent: 5498467 (1996-03-01), Meola
patent: 6465742 (2002-10-01), Hiraoka et al.
patent: 6703565 (2004-03-01), Tsukamoto et al.
patent: 7017264 (2006-03-01), Ikeda et al.
patent: 2003/0022102 (2003-01-01), Hiraoka et al.
patent: 6-275662 (1994-09-01), None
patent: 8-167630 (1996-06-01), None
patent: 2000-341032 (2000-08-01), None
patent: 2001-345537 (2001-12-01), None

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