Metal fusion bonding – Process – Plural joints
Patent
1992-09-08
1994-03-01
Rowan, Kurt C.
Metal fusion bonding
Process
Plural joints
228187, 228223, 21912164, B23K 3102
Patent
active
052899667
ABSTRACT:
A method is provided for electrically connecting a first electronic component which is not resistant to a reflowing temperature and a second electronic component which is resistant to the reflowing temperature to a substrate. The method includes the steps of applying cream solder to a first predetermined portion of the substrate so that the first electronic component is connected therewith and to a second predetermined portion of the substrate so that the second electronic component is connected therewith, mounting the second electronic component on the substrate, heating the second electronic component mounted on the substrate by reflowing so as to solder the second electronic component onto the substrate, forming a pre-soldered portion made of cream solder on the first predetermined portion of the substrate, applying flux to one of the first electronic component and the pre-soldered portion, mounting the first electronic component on the first predetermined portion of the substrate, melting the cream solder of the pre-soldered portion by heating the substrate locally, and soldering the first electronic component onto the substrate. Another method for electrically connecting an unwashable electronic component and a washable electronic component to a substrate includes similar steps to those of the method above.
REFERENCES:
patent: 3586816 (1971-06-01), Hagen
patent: 3632955 (1972-01-01), Cruickshank et al.
patent: 3811182 (1974-05-01), Ryan, Sr. et al.
patent: 4196839 (1980-04-01), Davis
patent: 4889275 (1989-12-01), Mullen, III et al.
patent: 5167361 (1992-12-01), Liebman et al.
Inutsuka Ryoji
Izumi Yasuo
Sato Syoji
Yamauchi Hiroshi
Knapp Jeffrey T.
Matsushita Electric - Industrial Co., Ltd.
Rowan Kurt C.
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