Etching a substrate: processes – Forming or treating electrical conductor article – Forming or treating of groove or through hole
Patent
1995-02-08
1996-10-08
Powell, William
Etching a substrate: processes
Forming or treating electrical conductor article
Forming or treating of groove or through hole
216 20, B44C 122
Patent
active
055628370
ABSTRACT:
The multi-chip module comprises a co-fired substrate, and, on at least ont face of the substrate, a set of superimposed ceramic insulating layers, fired at a temperature substantially smaller than the firing temperature of the substrate. Conducting interconnection lines are formed in thick layers deposited between said ceramic insulating layers. Electronic components are mounted at the surface of the set of ceramic layers.
REFERENCES:
patent: 5176772 (1993-01-01), Ohtaki
patent: 5378313 (1995-01-01), Pace
3rd IEEE/CHMT IEMTS, Oct. 12-14, 1987, Anaheim, CA, USA "A Composite Multilayer Ceramic Substrate for High-Performance Multi-Chip Packages"-A. Doya et al-pp. 102-108.
IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 12, N.degree.4, Dec. 1989, New York, USA "A New Multichip Module Using a Copper Polyimide Multilayer Substrate"-Sasaki et al-pp. 658-662.
IBM Technical Disclosure Bulletin, vol. 21, N.degree.10, Mar. 1979, New York, USA "Hermetic Hybrid Module"-Martin et al-pp. 4023-4024.
Matra Marconi Space France
Powell William
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