Method for connecting electrodes, surface-treated wiring...

Details Method for connecting electrodes, surface-treated wiring... Method for connecting electrodes, surface-treated wiring...

2007-08-21

2007-08-21

Tran, Thao (Department: 1711)

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

C428S3550AC

Reexamination Certificate

active

10345166

ABSTRACT:
An adhesive film including a reactive adhesive capable of curing by heating or light irradiation and a polyphthalide represented by the formula I:wherein R represents a divalent aromatic hydrocarbon group or a divalent heteroring-containing aromatic group, R1represents an alkyl group, a Fluorinated alkyl group, an alkoxy group or a halogen atom, where the number of R1is 0 to 4, X represents O or N—R3, provided that R3represents one of the following groups,Y represents SO2or CO and n represents a number of repeating units in the polymer. The adhesive film can be used to connect, e.g., electrodes of a semiconductor chip to electrodes of a wiring board. The polyphthalide can be used to surface-treat, e.g., electrodes of a wiring board.

REFERENCES:
patent: 3371128 (1968-02-01), Neuse et al.
patent: 4652608 (1987-03-01), Parker
patent: 4786569 (1988-11-01), Rohde et al.
patent: 5494764 (1996-02-01), Hyodo
patent: 51-105827 (1976-09-01), None
patent: 10-298278 (1998-11-01), None
patent: 2002-241591 (2002-08-01), None

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