Method for connecting electrodes having apertures

Details Method for connecting electrodes having apertures Method for connecting electrodes having apertures

2011-06-21

2011-06-21

Trinh, Minh (Department: 3729)

Metal working

Barrier layer or semiconductor device making

Barrier layer device making

C029S025410, C029S025420, C361S521000, C361S509000, C607S005000

Reexamination Certificate

active

07963999

ABSTRACT:
One embodiment includes a method that includes positioning a first substantially planar electrode including material defining a first aperture into a capacitor stack in alignment with a second substantially planar electrode such that a first non-aperture portion of the second substantially planar electrode at least partially overlays the first aperture and joining the first substantially planar electrode to the second substantially planar electrode proximal the material defining the first aperture and the first non-aperture portion of the second substantially planar electrode.

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