Method for connecting circuit devices

Details Method for connecting circuit devices Method for connecting circuit devices

2005-05-24

2005-05-24

Le, Dung A. (Department: 2818)

Semiconductor device manufacturing: process

Having selenium or tellurium elemental semiconductor component

C438S108000, C438S109000, C257S777000, C257S778000

Reexamination Certificate

active

06897088

ABSTRACT:
A method of connecting a first and second circuit device includes providing a first circuit device having a first main area and a second circuit device having a second and a third main area. A spacer device is disposed on one of the first and second circuit devices to ensure a predetermined spacing between the first and second circuit devices. An adhesive is applied to at least one of the first main area and the second main area and the first and second circuit devices are aligned and joined. The adhesive is then cured.

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