Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2006-04-04
2006-04-04
Zarneke, David A. (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S613000
Reexamination Certificate
active
07022549
ABSTRACT:
An integrated circuit, in particular from a chip, a wafer or a hybrid, to a substrate. A package is provided for the integrated circuit, which has a connection side, on which there are provided a plurality of connection regions for connection to the substrate. A corresponding plurality of connection regions are provided on the substrate, and elevated contact regions are provided on the connection regions of the package and/or the connection regions of the substrate. The elevated contact regions include a first group of contact regions and a second group of contact regions. A connection of the package to the substrate is created via the elevated contact regions. The elevated contact regions configured such that the first group of contact regions form a rigid connection and the second group of contact regions form an elastic connection between the package and the substrate. The invention likewise provides a corresponding circuit arrangement.
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Hedler Harry
Irsigler Roland
Meyer Thorsten
Infineon - Technologies AG
Morrison & Foerster / LLP
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