Registers – Records – Conductive
Reexamination Certificate
2011-08-02
2011-08-02
Lee, Seung H (Department: 2887)
Registers
Records
Conductive
Reexamination Certificate
active
07988059
ABSTRACT:
A method for connecting an electronic chip (10) to contacts (47and48) of an electric circuit, the chip having two conductive plates (31and32) located on the last layer of the chip and at least one electromagnetic shielding layer, at least one of the plates (31or32) being entirely covered with an electrical insulating layer (34). The method includes placing an adhesive dielectric material (40) on the circuit between the contacts (47, 48), to fix the electronic chip (10) relative to the circuit, positioning electronic chip (10) on the circuit so that conductive plates (31et32) are opposite the contacts (47and48), so as to create between the chip and the electric circuit at least one capacitive link made up of the conductive plate (31or32), the electrically insulating layer and the contact (47or48).
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patent: 6786419 (2004-09-01), Kayanakis
patent: 6910636 (2005-06-01), Kim et al.
patent: 7102520 (2006-09-01), Liu et al.
patent: 7597266 (2009-10-01), Benato
patent: 2005/0148112 (2005-07-01), Weekamp et al.
patent: 100 64 411 (2002-06-01), None
patent: 101 33 588 (2002-09-01), None
patent: WO 2006/009934 (2006-01-01), None
Grasset Yannick
Halope Christophe
Pangaud Nicolas
ASK S.A.
Lee Seung H
Lydon James C.
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