Method for connecting an electromagnetic wave shielding layer wi

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29601, 174264, B05D 512, H01Q 1700

Patent

active

051962306

ABSTRACT:
A method for connecting a ground circuit and an electromagnetic wave shielding layer for a printed wiring circuit in a printed circuit board is disclosed. The method comprising the steps of forming said insulating layer by a plurality of insulating layers and gradually increasing from the printed wiring circuit side to the electromagnetic wave shielding layer side, a diameter of an aperture of the ground circuit of each insulating layer in the process for forming the insulating layer.

REFERENCES:
patent: 4789760 (1988-12-01), Koyama et al.
Benjamin, C. E., High-Current Internal Contact Structure For ICs, IBM Technical Discl. Bull., vol. 19, No. 10, Mar. 1977.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for connecting an electromagnetic wave shielding layer wi does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for connecting an electromagnetic wave shielding layer wi, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for connecting an electromagnetic wave shielding layer wi will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1350439

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.