Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1991-02-19
1993-03-23
Echols, P. W.
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
29601, 174264, B05D 512, H01Q 1700
Patent
active
051962306
ABSTRACT:
A method for connecting a ground circuit and an electromagnetic wave shielding layer for a printed wiring circuit in a printed circuit board is disclosed. The method comprising the steps of forming said insulating layer by a plurality of insulating layers and gradually increasing from the printed wiring circuit side to the electromagnetic wave shielding layer side, a diameter of an aperture of the ground circuit of each insulating layer in the process for forming the insulating layer.
REFERENCES:
patent: 4789760 (1988-12-01), Koyama et al.
Benjamin, C. E., High-Current Internal Contact Structure For ICs, IBM Technical Discl. Bull., vol. 19, No. 10, Mar. 1977.
Ichikawa Jun-ichi
Nikaido Katsutomo
Okonogi Hirotaka
Adams Bruce L.
Echols P. W.
Nippon CMK Corp.
Wilks Van C.
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