Method for connecting a leadless chip carrier to a substrate

Details Method for connecting a leadless chip carrier to a substrate Method for connecting a leadless chip carrier to a substrate

1990-01-02

1991-03-26

Hall, Carl E.

Metal working

Method of mechanical manufacture

Electrical device making

118697, 174 522, 2281802, 357 80, 361412, 427 96, H05K 334

Patent

active

050018299

ABSTRACT:
A Leadless Chip Carrier (LCC) is mounted on a circuit board on elongated solder posts to provide clearance between the LCC and the board. The process for producing solder posts involves the deposition of a temporary stencil surrounding the conductive pads on the board. The removable stencil around the pads provides support for molten solder during reflow and prevents the chip carrier from compressing the molten solder thereby insuring desirable spacing between the chip carrier and the board.

REFERENCES:
patent: 4184043 (1980-01-01), Hildering
patent: 4642889 (1987-02-01), Grabbe
patent: 4763407 (1988-08-01), Abe
patent: 4788767 (1988-12-01), Desai et al.
IBM Tech. Discl. Bull., vol. 23, No. 5, Oct. 1980, pp. 2156-2157 by Galloway et al.
IBM Tech. Discl. Bull., vol 24, No. 9, Feb. 1982, pp. 4647-4649 by Audi.

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