Method for connecting a die to electrically conductive traces on

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

437209, 437211, 437214, 437217, H01L 2160

Patent

active

056311915

ABSTRACT:
A polymer lead-frame is made from a flexible substrate with flexible conductive traces. The generally square lead-frame has diagonal cutouts partially extending from the corners towards the center, as well as a central hole that lies within a footprint of the die. The die is bonded directly to the lead frame, preferably with anisotropic, electrically conductive adhesive. The die is placed with the lead frame in a fixture. A holding force is applied to secure the die and, if necessary, a curing force is applied during a cure cycle. The fixture allows transport of the assembly to a curing oven and allows application of the curing force. The die has contact pads characterized by a non-planar, non-bump-like surface with concavities having depths of at least about one-seventh the diameter of conductive particles in the anisotropic conductive adhesive.

REFERENCES:
patent: 4048438 (1977-09-01), Zimmerman
patent: 4234666 (1980-11-01), Gursky
patent: 4677526 (1987-06-01), Machling
patent: 4744850 (1988-05-01), Imano
patent: 4811081 (1989-03-01), Lyden
patent: 4816427 (1989-03-01), Dennis
patent: 5010038 (1991-04-01), Fox et al.
patent: 5018005 (1991-05-01), Lin
patent: 5053357 (1991-10-01), Lin
patent: 5156983 (1992-10-01), Schlesinger et al.
patent: 5212402 (1993-05-01), Higgins, III
patent: 5224264 (1993-07-01), Takahashi et al.
patent: 5341027 (1994-08-01), Park et al.
patent: 5401688 (1995-03-01), Yamaji et al.
Ken Gilleo, PhD., "Direct Chip Interconnect Using Polymer Bonding", 39th Electronics Components Conference (1989) pp. 37-44.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for connecting a die to electrically conductive traces on does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for connecting a die to electrically conductive traces on, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for connecting a die to electrically conductive traces on will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1723602

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.