Method for conforming a micro-electronic array to arbitrary...

Optical: systems and elements – Optical modulator – Light wave temporal modulation

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S723000

Reexamination Certificate

active

11223872

ABSTRACT:
Described is a method for conforming electronics to arbitrary shapes. The method comprises acts of forming a device structure to have a growth substrate, an etch stop layer affixed with the growth substrate, and a micro-electronic array. The micro-electronic array comprises a plurality of components atop the etch stop layer. The micro-electronic array is thereafter embedded into a shrinkable layer. The shrinkable layer is then mounted onto a handle wafer that includes a layer of adhering film with the shrinkable layer being pressed into the layer of adhering film. The growth substrate and the etch stop layer are thereafter removed. The adhering film is then dissolved to demount the micro-electronic array and shrinkable layer. Finally, the shrinkable layer is shrunk to conform the micro-electronic array to a three-dimensional shape, with the growth orientation flipped such that metal interconnects may be made to both the top and bottom of the chip.

REFERENCES:
patent: 6455931 (2002-09-01), Hamilton et al.
patent: 6566276 (2003-05-01), Maloney et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for conforming a micro-electronic array to arbitrary... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for conforming a micro-electronic array to arbitrary..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for conforming a micro-electronic array to arbitrary... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3865553

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.