Method for conductively interconnecting circuit components on op

Details Method for conductively interconnecting circuit components on op Method for conductively interconnecting circuit components on op

1982-06-03

1984-10-23

Smith, John D.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427238, 118 50, 118406, 118408, H05K 340

Patent

active

044788827

ABSTRACT:
A layer of dielectric material, carrying printed or thick-film circuit components on opposite surfaces, is provided with one or more bores extending between aligned circuit points to be conductively interconnected. The layer is sandwiched between two masks having a perforation of larger diameter in line with each bore, such perforation communicating with a respective chamber in an adjoining member forming part of a pair of clamp jaws pressing the masks against the layer. A conductive liquid or paste in one chamber is pumped through each bore from one chamber into the other, via the adjoining perforations, by the respective application of pressure and suction to these chambers with the aid of membranes or pistons moving codirectionally in one or more strokes.

REFERENCES:
patent: 3160930 (1974-12-01), Fisher
patent: 3268653 (1966-08-01), McNutt
patent: 3650804 (1972-03-01), Parisi
patent: 4064290 (1977-12-01), Ebel et al.

Affiliated with

Also associated with

Rating

Method for conductively interconnecting circuit components on op does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for conductively interconnecting circuit components on op, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for conductively interconnecting circuit components on op will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1599194