Method for conducting heat to or from an article being treated u

Details Method for conducting heat to or from an article being treated u Method for conducting heat to or from an article being treated u

1979-09-14

1981-04-14

Rutledge, L. DeWayne

Metal treatment

Compositions

Heat treating

118 50, 118728, 165104R, 250398, 250492A, 357 91, 427 38, H01J 3700, H01L 2344

Patent

active

042617626

ABSTRACT:
A method and apparatus are disclosed for providing heat conduction between an article being treated in a vacuum and a support member by providing a gas under pressure of about 0.5 to 2.0 Torr between the article and the support member. The method and apparatus are described for use in a semiconductor wafer ion implantation system wherein the wafer is clamped to the support member which is cooled. A seal can be provided between the wafer and the support member adjacent the periphery of the article.

REFERENCES:
patent: 3351731 (1967-11-01), Tanaka
patent: 3624391 (1971-11-01), Davison
patent: 3818982 (1974-06-01), Wagner
patent: 3993123 (1976-11-01), Chu et al.
patent: 4067042 (1978-01-01), Novak et al.
patent: 4118630 (1978-10-01), McKenna et al.
patent: 4155011 (1979-05-01), Mark
patent: 4162401 (1979-07-01), King et al.
Asselman et al., "Heat Pipes," Philips Tech. Rev. 33 (1973), 104-113.

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