Method for conducting electroless metal-plating processes

Coating processes – Measuring – testing – or indicating

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134 3, 204195F, 204292, 427401, 427430A, 427438, C23C 302

Patent

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041256425

ABSTRACT:
This invention is an improved method for conducting electroless metal-plating processes in a metal tank which is exposed to the plating bath. The invention solves a problem commonly encountered in such processes: how to determine when it is advisable to shutdown the process in order to clean and/or re-passivate the tank.
The new method comprises contacting the bath with a current-conducting, non-catalytic probe and, during plating operations, monitoring the gradually changing difference in electropotential between the probe and tank. It has been found that the value of this voltage is indicative of the extent to which nickel-bearing decomposition products accumulate on the tank. By utilizing the voltage to determine when shutdown for cleaning is advisable, the operator can avoid premature shutdown and at the same time avoid prolonging operations to the point that spontaneous decomposition occurs.

REFERENCES:
patent: 2874083 (1959-02-01), Metheny
patent: 3903319 (1975-09-01), El-Mohamad
patent: 3934054 (1976-01-01), Schmeling
Greene et al., "Evaluating the Condition of Electroless Plating Baths", IBM Technical Disclosure Bulletin, vol. 7, No. 3, 8-1964.
Pearlstein, "Electroless Plating", Modern Electroplating, John Wiley & Sons, .COPYRGT. 1974, pp. 710 to 714.

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