Method for conditioning the surface of a polishing pad

Details Method for conditioning the surface of a polishing pad Method for conditioning the surface of a polishing pad

1990-09-12

1992-01-14

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437228, 437946, 51325, B24B 100, H01L 21302

Patent

active

050810510

ABSTRACT:
An improved method for conditioning the surface of a pad for polishing a dielectric layer formed on a semiconductor substrate is disclosed. In one embodiment, the serrated edge of an elongated blade member is first placed in radial contact with the surface of the polishing pad. The table and the pad are then rotated relative to the blade member. At the same time, the blade member is pressed downwardly against the pad surface such that the serrated edge cuts a plurality of substantially circumferential grooves into the pad surface. These grooves are dimensioned so as to facilitate the polishing process by creating point contacts which increases the pad area and allows more slurry to applied to the substrate per unit area. Depending on the type of pad employed, the number of teeth per inch on the serrated edge, the type of slurry used, etc., the downward force applied to the blade member in the rotational speed of the table are optimized to obtain the resultant polishing rate and uniformity desired.

REFERENCES:
patent: 4213277 (1980-07-01), Fivian
patent: 4947598 (1990-08-01), Sekiya

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