Method for conditioning semiconductor wafers and/or hybrids

Details Method for conditioning semiconductor wafers and/or hybrids Method for conditioning semiconductor wafers and/or hybrids

2011-03-08

2011-03-08

Gravini, Stephen M. (Department: 3743)

Drying and gas or vapor contact with solids

Process

With nondrying treating of material

C034S413000, C034S497000, C034S492000, C034S495000, C118S712000, C324S760020

Reexamination Certificate

active

07900373

ABSTRACT:
The present invention provides a method for conditioning semiconductor wafers and/or hybrids having the steps: preparation of a space (1) which is at least partially enclosed and has a wafer/hybrid holding device (10) which is located therein and has the purpose of holding a semiconductor wafer and/or hybrid; and conduction of a dry fluid through the wafer/hybrid holding device (10) in order to heat-treat the wafer/hybrid holding device (10); wherein at least a portion of the fluid leaving the wafer/hybrid holding device (10) is used to condition the atmosphere within the space (1). The invention also provides a corresponding device for conditioning semiconductor wafers and/or hybrids.

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