Method for conditioning drilled holes in multilayer wiring board

Details Method for conditioning drilled holes in multilayer wiring board Method for conditioning drilled holes in multilayer wiring board

1975-12-05

1977-03-15

Mack, John H.

Chemistry: electrical and wave energy

Processes and products

Vacuum arc discharge coating

204164, 156644, 29625, 29628, 174 685, C23C 1500

Patent

active

040123073

ABSTRACT:
A method for conditioning drilled holes in multilayer printed wiring boards by removing layers of smeared plastic and adhesive prior to metal plating through the holes for interconnecting conductive layers of the boards includes baking the drilled boards and etching the boards within a plasma reactor chamber, with a predetermined gas pressure, the plasma being created by an RF generator. At the end of a predetermined time period, the RF generator is deactivated and atmospheric air is admitted to the reactor chamber. The reactor chamber is then purged of gases and the printed wiring boards are removed.

REFERENCES:
patent: 3276106 (1966-10-01), Bester et al.
patent: 3410774 (1968-11-01), Barson et al.
patent: 3598710 (1971-08-01), Davidse
patent: 3705055 (1972-12-01), Christensen et al.
patent: 3867216 (1975-02-01), Jacob
patent: 3930913 (1976-01-01), Jacob

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