Method for conditioning a surface of a dielectric substrate for

Details Method for conditioning a surface of a dielectric substrate for Method for conditioning a surface of a dielectric substrate for

1985-01-31

1985-11-19

Smith, John D.

Coating processes

With pretreatment of the base

Preapplied reactant or reaction promoter or hardener

156630, 156632, 156666, 156901, 430315, 430327, 427305, 427306, 427 98, C23C 302

Patent

active

045541825

ABSTRACT:
Method for electroless plating metals, such as copper, onto non-conductive substrate surfaces. The method comprises bringing the surfaces into contact with an aqueous composition containing H.sub.2 SO.sub.4 and a multifunctional cationic copolymer containing at least two available cationic moieties and then activating the surfaces by treating them with a colloidal solution containing palladium chloride, stannous chloride and HCl.
The inventive method is particularly useful in processes for producing metal circuits on substrates of glass, thermoplastics and thermosetting resins, such as epoxy cards and boards. The method is also applied in reworking substrates having already undergone copper plating and having been rejected due to failures.

REFERENCES:
patent: 4448804 (1984-05-01), Amelio
patent: 4478883 (1984-10-01), Bupp

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