Method for conditioning a substrate for subsequent electroless m

Details Method for conditioning a substrate for subsequent electroless m Method for conditioning a substrate for subsequent electroless m

1992-03-23

1995-08-22

Beck, Shrive

Coating processes

With pretreatment of the base

Preapplied reactant or reaction promoter or hardener

427305, 427306, B05D 100

Patent

active

054438659

ABSTRACT:
Substrates are activated for subsequent metallization by contacting the substrate with a electrolyte in which reducing agents which are electrochemically generated in the electrolyte. The reducing agents are sorbed by the substrate which is contacted with a seeding medium to dispose on the substrate seed, preferably palladium seed for subsequent electroless and electrolytic metallization.

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