Abrading – Machine – Rotary tool
Patent
1996-05-21
1999-03-09
Chang, Ceila
Abrading
Machine
Rotary tool
451285, 451 56, 451 60, 438692, 438693, 438694, 216 38, B24B 53007
Patent
active
058792260
ABSTRACT:
A method for conditioning a polishing pad used in chemical-mechanical planarization of semiconductor wafers. Waste matter on the polishing pad is dissolved with a conditioning solution selected to chemically dissolve the material of the waste matter. The conditioning solution preferably coats the areas on the wafer upon which the waste matter tends to accumulate during planarization. After a desired amount of waste matter is dissolved into the conditioning solution to bring the pad into a desired condition without mechanically abrading the waste matter from the pad, the conditioning solution containing the dissolved waste matter may be removed from the pad.
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Chang Ceila
Micro)n Technology, Inc.
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